The chip fabrication process begins with
A. a package
B. An ingot
C. a wafer
D. a die
Answer: B. An ingot
The chip fabrication process begins with
A. a package
B. An ingot
C. a wafer
D. a die
Answer: B. An ingot
A. a package
B. An ingot
C. a wafer
D. a die
Answer: B. An ingot
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