The chip manufacturing process begins with
A. Checking the wafer for defects
B. A silicon ingot
C. A large, sausage-shaped piece of silicon
D. Slicing and dicing
E. Slices of silicon about 0.1" thick
F. Photolithography
G. Doping the silicon surface
Answer:
B. A silicon ingot
C. A large, sausage-shaped piece of silicon
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